NPI uses state-of-the-art automated equipment to maintain the highest quality standards and ensure that the products we manufacture exceed all specified IPC Class 2 and Class 3 requirements. Assembly certifications include IPC-A-610, Class 1, 2, and 3, as well as IPC/EIA J-STD-001 and IPC/EIA J-STD-001 with Space Addendum.

NPI’s assembly services operation utilizes only high quality assembly equipment, many of which can be seen below.

Our advanced assembly team possesses six Samsung “Pick and Place” machines that are all feeder and program compatible, and allow productions runs to be shared or moved at any time, making it possible for us to meet any of your schedule requirements with ease. We are proud to say that our SMT placement capability is down to 01005 passives.



Our Selective Solder station equipped with pre-heat and nitrogen bath solder pot to eliminate oxidation.Selective soldering 2individually fluxes and solders each connection avoiding the need for masking as well as solder disturbance associated with wave soldering.


Nine-zone Infrared (IR) reflow oven with a built-in thermocouple and profiling software system.




Our Automated Optical Inspection (AOI), 5 camera system with 10 megapixel capacity is capable of detecting component orientation, value, and presence. This sophisticated PCB assembly tool comes equipped with a laser for confirmation of BGA co-planarity. Program capability for first level solder inspection as well as in-process solder inspection.



Aqueous in-line, closed loop, wash system operating with pure deionized water. Water filtration utilizes two resin and two carbon filters, which is monitored for resistivity.



110KV X-ray Digital Imaging System with auto-detect characteristics. This machine is capable of performing a 100% BGA X-ray.



This is our Hot Bar Soldering machine, capable of soldering flex circuits to rigid PCBs.

Our BGA rework station is used for large (18”x22”) and complex PCBs and has 9 IR programmable top/bottom heating zones. The station has fully programmable soldering profiles with temperature measurement feedback in up to 5 points on the circuit board simultaneously. Reflow can be watched in real time via a 3.2-megapixel high-magnification video camera. Precise placement of large BGA, TQPF, QFN etc.components is accomplished with the help of a pick-and-place arm with a split-optic positioning system.


  • NPI uses 3 levels of final inspection to drive our desire to deliver high quality products that are built to specifications and are SOW compliant.

  • NPI offers quick turn assembly options ranging from 2 to 10 days in addition to scheduled production runs based on your delivery requirements

  • NPI services supports high mix, prototype, and mid to low volume quantities with extended capabilities to handle runs of several thousand pieces or more.

Assembly technologies supported by NPI include:

  • SMT, thru-hole, back panel (board sizes from ¼” x ¼” to 16” x 38”)

  • Wire bonding

Other assembly services:

  • Press-fit

  • Bonding

  • Rework

  • BGA removal

  • BGA replacement

  • BGA re-balling (down to 12 mil balls)

Solder technologies include:

  • Water soluble leaded and lead free

  • 52In/48Sn low temp (140C) solder

Component placement capability and preparation:

  • Passives down to 01005 size machine placed

  • BGA, VFBGA, CGA to .3mm pitch

  • Leadless Chip Carriers / CSP, QFN

  • Reels, carriers, tubes, cut tape, or loose pieces