A core component of any prototype or production run is the bare printed circuit board (PCB) onto which the components are installed. For this reason, NPI pays particular attention not only to maintaining the highest quality standards, but also to ensure both quality materials are used and PCB fabrication techniques employed are an ideal match to the PCB specification requirements of our customers. IPC Class 2 and Class 3 PCB fabrication is available along with a variety of surface finishes (HASL, Lead-Free HASL, ENIG, ENEPIG, and more) and material (Isola, Nelco, Arlon, Rogers, and more) options.

NPI’s quickturn PCB fabrication services fall into three distinct groups: Conventional PCBs, Flex/Rigid-Flex PCBs, and HDI PCBs.

Flex and Rigid-Flex PCB’s

Rigid-Flex circuitry provides a simple means to integrate multiple PCB assemblies and other elements such as display, input, or storage devices without using wires, cables or connectors, replacing them with thin, light composites that integrate wiring in ultra-thin, flexible ribbons between sections.

 

NPI offers flexible and rigid-flex PCB fabrication for commercial (computer, telecommunications, instrumentation, etc.), medical, aerospace, and defense markets under the following classifications:

 

Type 1: Single sided flexible material with or without shield(s) or stiffener (one

conductive layer)

Type 2: Double sided flexible material with or without shield(s) or stiffener (two

conductor layers) with plated through-holes

Type 3: Multilayer flexible material with or without shield(s) or stiffener (more

than two conductor layers) with plated through-holes and HDI

Type 4: Multilayer rigid and flexible material combinations (more than

two conductor layers) with plated through-holes and HDI

Flex & Rigid Flex Features:

  • 1-30+ Layer Capability

  • IPC 6013 types 1,2,3, & 4

  • Complex Balanced and Unbalanced Structure

  • MIL-SPEC and UL Qualified

  • Acrylic, Epoxy, and Adhesive-less Polymide

  • Silver Film and Silver Ink EMI Shielding

  • Custom Surface Finishes Available

  • Flex Assembly Services

  • Custom Forming and Fitting on Flex

  •  

    HDI PCBs
    HDI PCBs capitalize on the latest circuit board fabrication technologies available to increase the functionality of PCBs using the same or less amount of surface area. HDI PCBs are characterized by high-density attributes including laser microvias, fine lines, and high performance thin materials. This increased density enables more functions per unit area. Higher technology HDI PCBs have multiple layers of copper filled stacked microvias (Advanced HDI PCBs), which creates a structure that enables even more complex interconnections. These very complex structures provide the necessary routing solutions for today’s large pin-count chips utilized in mobile devices and other high technology products.

     

    Surface Finish OptionsThe following surface finish options are available:

    • Tin-Lead HASL
    • Lead-Free HASL
    • ENIG
    • ENEPIG
    • Ni & Hard Au
    • Ni & Soft Au
    • Immersion Silver
    • Immersion Tin
    • OSP

     

    Class 2 and Class 3 PCB Fabrication

    • Class 2 PCB Fabrication: meant for dedicated service electronic products where continued performance and extended life is required, and for which uninterrupted service is desired but not critical.
    • Class 3 PCB Fabrication: meant for high reliability electronic products that demand continued high performance and equipment downtime cannot be tolerated such as life support systems and other critical systems e.g.pacemaker, satellite, radar signals, etc.

    Conventional PCBs

    Conventional PCBs can be any layer count, but rely on conventional drilling and plating technology.

     

    Conventional PCB features:

    • Multilayer up to 60+ layers

    • Laminate options: high temp, low loss, lead-free

    • Mixed dielectric (hybrid) constructions

    • Panel size up to 30″x 55″

    • Embedded coin, or metal core and metal backed MLB

    • Panel thickness up to .450″

    • RF and microwave circuits

    • Capabilities include:

      • Vertical and Horizontal Launch Sites

      • Multilevel Cavity constructions

      • Exact registration/Laser Direct Imaging

      • Optical routing referencing launch pads

      Precision Stub Removal

      • Mechanical back-drilling (Minimal stub)

      • Laser drilling (No stub)

      • Laser modified controlled depth drill (No stub)

    • Heavy copper (10 oz. outer layer / 5 oz. inner layer)

    • Embedded, distributed and discrete passive components